SEMICON CHINA 2026

From March 25 to 27, 2026, Semicon China 2026, the world's largest semiconductor exhibition, successfully concluded in Shanghai. 

The exhibition, themed "Crossing Borders Globally, Connecting Hearts and Chips," brought together cutting-edge technologies from around the world, illuminating the path of industry development with the light of innovation. 

Devol showcased its fully automatic IC wire bonding machines, linear IC die bonder machines, high-speed/high-precision ultra-thin die attach machines, and loose-piece pick-and-place machines at the booth, attracting numerous professional visitors to stop by and engage. 

Engineers demonstrated the equipment and explained the technology, vividly presenting product functions and application scenarios, fully highlighting the advantages of the equipment and Devol's innovative strength. 

The exhibition has successfully concluded, and we thank all the guests who visited our booth. The pace of innovation never stops, and the spirit of striving will continue. 

Let us look forward to Devol bringing more new products in the packaging and testing field, and see you next year at SEMICON China!