DAA won the Best Brand Enterprise Award for China's Semiconductor Packaging and Testing Equipment

The "Best Semiconductor Packaging and Testing Equipment Brand in China" award unveiled its winners in Shanghai.At the 2026 China Advanced Semiconductor Packaging and Testing Conference held on March 23, Devol  Advanced stood out from numerous shortlisted companies and won the honor, thanks to its leading technological innovation capabilities and strong market reputation, successfully passing the rigorous evaluation by the expert review panel.

The conference, hosted by Today Semiconductor, is a well-known event in the packaging and testing industry for over ten years, gathering more than 400 experts and company representatives from the semiconductor field to witness this moment of honor together. 

The "Best Equipment Brand Enterprise" award is an industry badge that earns trust and preference. The award not only highly recognizes the company's continuous leadership in core technologies but also highlights its significant growth in market reputation, industry influence, and deep customer trust, further consolidating Devol  Advanced's leading position as a benchmark brand in China's semiconductor packaging equipment sector.

With high-precision wire bonding machines as its core foundation, Devol is expanding its layout across the entire semiconductor packaging industry chain. 

The company's independently developed IC die bonders, test and sorting machines, and bulk chip placers have successfully passed strict client validations and entered large-scale production, marking that Devol Advanced now possesses comprehensive capabilities to provide diversified and innovative system solutions for semiconductor packaging processes.